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HWL 01 Wireless DFB Laser Chip

For Wireless Communication applications.
  • Commodity name： HWL 01 Wireless DFB Laser Chip

Category:

Laser Chips

Email：

info@hiefo.com

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  • Products Detail

  • Description

    HieFo’s high bandwidth and linear DFB Laser Chip is specifically designed for wireless communication applications. These lasers demonstrate industry-leading high linearity, high efficiency, high bandwidth, and low relative intensity noise based on HieFo’s efficient and low-noise laser design.

    Applications

    ■ Wireless Communications

    Features

    ■ 1270nm/1330nm/1370nm/1410nm wavelength

    ■ Cavity Length: 200 μm

    ■ Telcordia Technologies™ GR-468-CORE Compliant

    ■ RoHS Compliant

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