Press Release

HieFo Introduces High Efficiency CW Lasers for Silicon Photonics Transceivers

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Press Release

Press Release

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HieFo Unveils HOT25 Specialty DFB Laser Chip to Power Next-Generation OTDR Systems

2025

07-30

HieFo Unveils HOT25 Specialty DFB Laser Chip to Power Next-Generation OTDR Systems

2025

04-01

HieFo Introduces High Efficiency CW Lasers for Silicon Photonics Transceivers

Alhambra, CA, March 31st, 2025 – HieFo announced today the product launch of multiple new high-efficiency Continuous Wave DFB indium phosphide (InP) lasers, designed to address the ever-increasing demands of silicon photonics based optical transceivers.

2024

09-10

HieFo Introduces High Power DFB Laser Chip for Coherent Optical Transmission

ALHAMBRA, Calif., Sept. 09, 2024 (GLOBE NEWSWIRE) -- HieFo’s latest product release addresses the demanding requirements of Coherent Optical transmission by...

2024

09-04

Hiefo Introduces Next Generation High Power Gain Chip for Integrated Tunable Laser Assembly (xITLA)

ALHAMBRA, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- The latest Highest Efficiency Gain Chip design addresses critical market demands for higher optical output power and lower electrical power consumption. HieFo’s HGC20 C+band Gain Chip sets a new...

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2025.04.01

OFC 2025: HieFo Showcases Next-Gen Optical Solutions

Alhambra, California – March 24, 2025 - HieFo, a leading global optical chip technology company, is set to unveil multiple new innovative products at the Optical Fiber Communication Conference (OFC) in San Francisco from March 30 to April 3, 2025.

OFC 2025: HieFo Showcases Next-Gen Optical Solutions

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OFC 2025: HieFo Showcases Next-Gen Optical Solutions

2024.09.02

HieFo Acquires EMCORE's Chips Business and Wafer Fabrication Operations

HieFo Acquires EMCORE's Chips Business and Wafer Fabrication Operations Forward from Emcore’s press release on May 2. 2024

HieFo Acquires EMCORE's Chips Business and Wafer Fabrication Operations

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HieFo Acquires EMCORE's Chips Business and Wafer Fabrication Operations
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