HWL 01 Wireless DFB Laser Chip
- Commodity name： HWL 01 Wireless DFB Laser Chip
- Products Detail
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Description
HieFo’s high bandwidth and linear DFB Laser Chip is specifically designed for wireless communication applications. These lasers demonstrate industry-leading high linearity, high efficiency, high bandwidth, and low relative intensity noise based on HieFo’s efficient and low-noise laser design.
Applications
■ Wireless Communications
Features
■ 1270nm/1330nm/1370nm/1410nm wavelength
■ Cavity Length: 200 μm
■ Telcordia Technologies™ GR-468-CORE Compliant
■ RoHS Compliant
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